By Hao Yu,Chuan-Seng Tan,Chuan Seng Tan

ISBN-10: 9814699004

ISBN-13: 9789814699006

ISBN-10: 9814699012

ISBN-13: 9789814699013

3D integration is an rising expertise for the layout of many-core microprocessors and reminiscence integration. This e-book, Advances in 3D built-in Circuits and Systems, is written to aid readers comprehend 3D built-in circuits in 3 phases: gadget fundamentals, approach point administration, and genuine designs.

Contents offered during this publication contain fabrication ideas for 3D TSV and 2.5D TSI; machine modeling; actual designs; thermal, strength and I/O administration; and 3D designs of sensors, I/Os, multi-core processors, and memory.

Advanced undergraduates, graduate scholars, researchers and engineers could locate this article beneficial for knowing the numerous demanding situations confronted within the improvement and development of 3D built-in circuits and systems.

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Advances in 3D Integrated Circuits and Systems (Series on Emerging Technologies in Circuits and Systems) by Hao Yu,Chuan-Seng Tan,Chuan Seng Tan


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